SCMT8 Wafer Thinning Machine

SCMT8 Wafer Thinning Machine

SCMT8 wafer thinning machine employs an in-feed machining principle, grinding rotating wafers through the rotation and vertical feed of a grinding wheel; it supports the processing of various materials, including 4-8 inch silicon and silicon carbide wafers etc.

 


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No. 49, Zonghui Road, Nanjing Economic and Technological Development Zone


sales@cgee.com.cn

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+86-025-86660150

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